The microstrain-accompanied structural phase transition from h-MoO₃ to α-MoO₃ investigated by in situ X-ray diffraction

• Zeqian Zhang,
• Honglong Shi,
• Boxiang Zhuang,
• Minting Luo and
• Zhenfei Hu

Beilstein J. Nanotechnol. 2023, 14, 692–700, doi:10.3762/bjnano.14.55

• transition from h-MoO3 to α-MoO3 Anisotropic thermal expansion and first-order phase transition The coefficient of thermal expansion (CTE) is an important mechanical parameter for the application of MoO3 thin films, as it can increase the mismatch between thin films and the substrate, causing microdevices to

A novel dry-blending method to reduce the coefficient of thermal expansion of polymer templates for OTFT electrodes

• Xiangdong Ye,
• Bo Tian,
• Yuxuan Guo,
• Fan Fan and
• Anjiang Cai

Beilstein J. Nanotechnol. 2020, 11, 671–677, doi:10.3762/bjnano.11.53

• achieved the alignment of OTFT electrodes using the composite template. Keywords: coefficient of thermal expansion; dry blending; organic thin-film transistors (OTFTs); OTFT electrodes; PDMS/SiO2 composite template; Introduction Organic thin-film transistors (OTFTs) provide a platform to construct next

• aligned [7]. However, the polymer template has a high coefficient of thermal expansion (CTE), resulting in alignment deviations of the OTFT electrodes [8][9]. Currently, one of the measures to reduce the CTE of polymer templates is wet blending, in which the low-CTE nanomaterial is directly incorporated

• Telecommunications, Xi’an 710121, China 10.3762/bjnano.11.53 Abstract Among the patterning technologies for organic thin-film transistors (OTFTs), the fabrication of OTFT electrodes using polymer templates has attracted much attention. However, deviations in the electrode alignment occur because the coefficient of

An advanced structural characterization of templated meso-macroporous carbon monoliths by small- and wide-angle scattering techniques

• Felix M. Badaczewski,
• Marc O. Loeh,
• Torben Pfaff,
• Dirk Wallacher,
• Daniel Clemens and
• Bernd M. Smarsly

Beilstein J. Nanotechnol. 2020, 11, 310–322, doi:10.3762/bjnano.11.23

• structures [51][52][53][54]. Key properties of glassy carbon materials, such as thermal conductivity, chemical resistance, hardness, density, and coefficient of thermal expansion are closely related to the carbon microstructure and the porosity. Resin-based carbon materials are known to possess a substantial

PTFE-based microreactor system for the continuous synthesis of full-visible-spectrum emitting cesium lead halide perovskite nanocrystals

• Chengxi Zhang,
• Weiling Luan,
• Yuhang Yin and
• Fuqian Yang

Beilstein J. Nanotechnol. 2017, 8, 2521–2529, doi:10.3762/bjnano.8.252

• the coefficient of thermal expansion, and β is the Debye temperature), increasing temperature leads to the decease of the band gap. This phenomenon makes it easy for the charge carriers (electrons and/or holes) to be activated and to move to a low energy state in comparison with the charge carriers at

Simulation of thermal stress and buckling instability in Si/Ge and Ge/Si core/shell nanowires

• Suvankar Das,
• Amitava Moitra,
• Mishreyee Bhattacharya and
• Amlan Dutta

Beilstein J. Nanotechnol. 2015, 6, 1970–1977, doi:10.3762/bjnano.6.201

• employs the method of atomistic simulation to estimate the thermal stress experienced by Si/Ge and Ge/Si, ultrathin, core/shell nanowires with fixed ends. The underlying technique involves the computation of Young’s modulus and the linear coefficient of thermal expansion through separate simulations

• ). The length of the simulation cell in the axial direction fluctuates during the MD simulation (Figure 1b). A derivative of the third-order polynomial fit to the thermal strain vs temperature results is used to obtain the coefficient of thermal expansion, α. The open source MD codes LAMMPS [27] and MD

• . Interestingly, the crossover between the elastic modulus of Si/Ge and Ge/Si NWs occurs near a core diameter of ≈7 nm. This is a structure with equal volume occupied by the core and shell parts of the material. The next step of our computation involved the estimation of coefficient of thermal expansion (CTE

Organic and inorganic–organic thin film structures by molecular layer deposition: A review

• Pia Sundberg and
• Maarit Karppinen

Beilstein J. Nanotechnol. 2014, 5, 1104–1136, doi:10.3762/bjnano.5.123

• between ALD-grown Al2O3 and a Teflon substrate, it was noticed that the stress caused by the difference in the coefficient of thermal expansion between the coating and the substrate was significantly reduced, preventing the cracking of the Al2O3 coating [96]. The first zincones were fabricated by

Functionalization of vertically aligned carbon nanotubes

• Eloise Van Hooijdonk,
• Carla Bittencourt,
• Rony Snyders and
• Jean-François Colomer

Beilstein J. Nanotechnol. 2013, 4, 129–152, doi:10.3762/bjnano.4.14

• curing was employed. This device has an ultrasmall coefficient of thermal expansion (CTE), good mechanical load transfer, and good phonon transport across the interface. The control of the CNT orientation within the polymer matrix (PM) and the control of the interaction between both components are of